GCJIS1000

Detailed Product Description

Xindaxin has special abrasive powder for wire-sawing semiconductor material, which
is different from traditional SiC abrasive powder, manufactured through many strict
working procedures, and under 12 quality control targets. The products have
the characteristics of high purity, high hardness, narrow distribution, good grain
shape, no coarse grains and can reach high quality requirement. It is used
for wire-sawing 3-8 inch single-crystal silicon, solar cell multi-crystal silicon,
gallium arsenide, quartz crystal and etc.. The powder is the engineering material
for semiconductor and solar cell industries. It can improve cutting efficiency,
reduce production cost, and guarantee the quality of the wafers.

Packing: 20kg, 25kg, 1000kg