green silicon carbide micro powder

Detailed Product Description

  We provide high-calss green silicon carbide micro power Mainly used for solar wafer cutting and semiconductor wafer cutting .

Features:

  (1)High purity and large crystal silicon carbide ingots ensure the excellent cutting capability and stable physical condition.

  (2)Grains are rounder with lots of sharper corner,which means minimum TTV.

  (3)Particle size distribution is narrow and even.

  (4)High heat-resisting and softing temperature under duty guarantee the small wire expansion in processing,suitable to all kinds of wiresaw machining.

  (5)Grain surface processed specially,easily fit carrier liquid,such as glycol.

 Specification:

 We could also produce the special specification according to the requirements of customer,to fit different wiresaw mechanisms,work pieces,diameter of the work piece and diameter of the wire.