Detailed Product Description GC/JIS1000 is the abrasive material for solar industry, semiconductor industry and piezoelctric industry.Technical standard:Size distribution(micron):D0≤32.00   D3≤19.00    D50=11.5±0.8    D94≥7.00Chemical...

Detailed Product Description 1. GC JIS800 passes through 18 working procedures2. Its major targets or quotas are: SiC Min98%, D0Max38micron, D3 Max31 micron, D5013-15 microns, D94Min9.0micron. 3. This product has already substituted for the import in at present, by domesticsilicon material...

Detailed Product Description 1. The advantage of the products: Because JIS1000 new big new edge material JIS1000because a foot-path is more meticulous, will save the expensive silicon materialgreatly while the silicon material is processed. 2. It is both popular to take in Japan and Zhejiang now....

Detailed Product Description Used for wire saw of 3-12 inch monocrystalline silicon, polycrystalline silicon,potassium arsenide, and quartz crystal, it is the abrasive material for solar industry,semiconductor industry, and piezoelectric industry20kg, 25kg, 1000kg/bag, or packed as the request ...

Detailed Product Description 1. GC JIS1200 passes through 18 working procedures2. Its major targets or quotas are: SiC Min98%, D0Max27micron, D3 Max23 micron, D508.7-10.3 microns, D94Min5.5 micron. 3. This product has already substituted for the import in at present, by domesticsilicon material...

Detailed Product Description Green silicon carbide powder is more and more widely used mainly in the manufacture of refractory products, ceramic foam industry, cutting silicon solar panels, cutting crystal polishing, original launch vehicles, special coatings industry, plastics modification and...

Detailed Product Description Xindaxin has special abrasive powder for wire-sawing semiconductor material, which is different from traditional SiC abrasive powder, manufactured through many strict working procedures, and under 12 quality control targets. The products have the characteristics of...

Detailed Product Description 1) High purity and large crystal silicon carbide ingots ensure the excellent cutting capability and stable physical condition. 2)Grains are rounder with lots of sharper corner,which means minimum TTV 3) Particle size distribution is narrow and even. We could also...

Detailed Product Description GC/F600 technical standard:Particle size distribution(micron):  D3≤17.00    D50=9.3±1.0    D94≥5Chemical composition%:SIC≥98.5   F.C≤0.13   Fe2O3≤0.13 ...

Detailed Product Description GC/F800 technical standard:Particle size distribution(micron):  D3≤12.00    D50=6.5±1.0    D94≥4Chemical composition%:SIC≥98.4   F.C≤0.13   Fe2O3≤0.10 ...